Showing 1–32 of 390 results
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Supermicro C7Z270-CG-LC7Z270-CG-LSupermicro C7Z270-PGC7Z270-PGSupermicro C7Z370-CG-LC7Z370-CG-LSupermicro Intel Motheboard X11SCA-FX11SCA-FSupermicro Intel Motheboard X11SCA-WX11SCA-WSupermicro Intel Mother Board X13DAI-TX13DAI-T
- 4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP
- Support CXL
- Intel® C741 Chipset
- Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots
- Broadcom BCM57416 Dual ports 10G LAN
- 2 SATA DOM ports
- 2 M.2
- 4 NVMe ports PCIe 5.0 x4 via 2 MCIO connectors
- 5 PCIe 5.0 x16
- 1 PCIe 5.0 x8
Supermicro Intel Mother Board X13DEIX13DEI- 4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP
- Support CXL
- Intel® C741 Chipset
- Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots
- 4 PCIe 5.0 x16
- 2 PCIe 5.0 x8
- Broadcom BCM5720 Dual ports 1G LAN
- 6 USB3.0 and 3 USB2.0
- 2 SATA DOM ports
- 2 M.2
Supermicro Intel Mother Board X13DEI-TX13DEI-T- 4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP
- Support CXL
- Intel® C741 Chipset
- Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots
- 4 PCIe 5.0 x16
- 2 PCIe 5.0 x8
- Broadcom BCM57416 Dual ports 10G LAN
- 6 USB3.0 and 3 USB2.0
- 2 SATA DOM ports
- 2 M.2
- 6 NVMe ports PCIe 5.0 x4 via 3 MCIO connectors
- 8 SATA3.0 ports
Supermicro Intel Mother Board X13SAEX13SAE- Form Factor: ATX
- Dimension 12″ x 9.6″ (30.48cm x 24.38cm)
- CPU
- 12th Generation Intel® Core™ i3/i5/i7/i9 Processors
- Single Socket LGA-1700 (Socket H5) supported, CPU TDP supports Up to 125W TDP
Supermicro Intel Mother Board X13SAE-FX13SAE-F- Form Factor: ATX
- Dimension 12″ x 9.6″ (30.48cm x 24.38cm)
- CPU
- 12th Generation Intel® Core™ i3/i5/i7/i9 Processors
- Single Socket LGA-1700 (Socket H5) supported, CPU TDP supports Up to 125W TDP
Supermicro Intel Mother Board X13SAN-CX13SAN-C- First performance hybrid architecture from Intel
- 4 independent display with 4K resolution
- Fast AI hardware acceleration
- Up to 64 EU with Intel® UHD graphics capable of 4K60 resolution
- Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
- High speed connectivity through dual 2.5GbE
- 100% wide temp grade design and components applied
- 12-24V wide range power with RVP and TVS
- Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
- Hailo-8™ powerful and efficient Edge AI solution integration ready
Supermicro Intel Mother Board X13SAN-C-WOHSX13SAN-C-WOHS- First performance hybrid architecture from Intel
- 4 independent display with 4K resolution
- Fast AI hardware acceleration
- Up to 64 EU with Intel® UHD graphics capable of 4K60 resolution
- Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
- High speed connectivity through dual 2.5GbE
- 100% wide temp grade design and components applied
- 12-24V wide range power with RVP and TVS
- Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
- Hailo-8™ powerful and efficient Edge AI solution integration ready
Supermicro Intel Mother Board X13SAN-EX13SAN-E- First performance hybrid architecture from Intel
- 4 independent display with 4K resolution
- Fast AI hardware acceleration
- Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
- Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
- High speed connectivity through dual 2.5GbE
- 100% wide temp grade design and components applied
- 12-24V wide range power with RVP and TVS
- Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
- Hailo-8™ powerful and efficient Edge AI solution integration ready
Supermicro Intel Mother Board X13SAN-E-WOHSX13SAN-E-WOHS- First performance hybrid architecture from Intel
- 4 independent display with 4K resolution
- Fast AI hardware acceleration
- Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
- Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
- High speed connectivity through dual 2.5GbE
- 100% wide temp grade design and components applied
- 12-24V wide range power with RVP and TVS
- Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
- Hailo-8™ powerful and efficient Edge AI solution integration ready
Supermicro Intel Mother Board X13SAN-HX13SAN-H- First performance hybrid architecture from Intel
- 4 independent display with 4K resolution
- Fast AI hardware acceleration
- Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
- Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
- High speed connectivity through dual 2.5GbE
- 100% wide temp grade design and components applied
- 12-24V wide range power with RVP and TVS
- Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
- Hailo-8™ powerful and efficient Edge AI solution integration ready
Supermicro Intel Mother Board X13SAN-H-WOHSX13SAN-H-WOHS- First performance hybrid architecture from Intel
- 4 independent display with 4K resolution
- Fast AI hardware acceleration
- Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution
- Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
- High speed connectivity through dual 2.5GbE
- 100% wide temp grade design and components applied
- 12-24V wide range power with RVP and TVS
- Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
- Hailo-8™ powerful and efficient Edge AI solution integration ready
Supermicro Intel Mother Board X13SAN-LX13SAN-L- First performance hybrid architecture from Intel
- 4 independent display with 4K resolution
- Fast AI hardware acceleration
- Up to 64 EU with Intel® UHD graphics capable of 4K60 resolution
- Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
- High speed connectivity through dual 2.5GbE
- 100% wide temp grade design and components applied
- 12-24V wide range power with RVP and TVS
- Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
- Hailo-8™ powerful and efficient Edge AI solution integration ready
Supermicro Intel Mother Board X13SAN-L-WOHSX13SAN-L-WOHS- First performance hybrid architecture from Intel
- 4 independent display with 4K resolution
- Fast AI hardware acceleration
- Up to 64 EU with Intel® UHD graphics capable of 4K60 resolution
- Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2
- High speed connectivity through dual 2.5GbE
- 100% wide temp grade design and components applied
- 12-24V wide range power with RVP and TVS
- Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2
- Hailo-8™ powerful and efficient Edge AI solution integration ready
Supermicro Intel Mother Board X13SAQX13SAQ- Form Factor: Micro-ATX
- Dimension 9.6″ x 9.6″ (24.38cm x 24.38cm)
- CPU
- 12th Generation Intel Core i9/Core i7/Core i5/Core i3/Pentium/Celeron Processor
- Single Socket LGA-1700 supported
Supermicro Intel Mother Board X13SAV-LVDSX13SAV-LVDS- Form Factor: Mini-ITX
- Dimension 6.7″ x 6.7″ (17.02cm x 17.02cm)
- CPU
- 12th Generation Intel Core i9/Core i7/Core i5/Core i3/Pentium/Celeron Processor
- Single Socket LGA-1700 supported
Supermicro Intel Mother Board X13SAZ-FX13SAZ-F- Form Factor: Micro-ATX
- Dimension 9.6″ x 9.6″ (24.38cm x 24.38cm)
- CPU
- 12th Generation Intel Core i9/Core i7/Core i5/Core i3/Pentium/Celeron Processor
- Single Socket LGA-1700 supported
Supermicro Intel Mother Board X13SAZ-QX13SAZ-Q- Form Factor: Micro-ATX
- Dimension 9.6″ x 9.6″ (24.38cm x 24.38cm)
- CPU
- 12th Generation Intel Core i9/Core i7/Core i5/Core i3/Pentium/Celeron Processor
- Single Socket LGA-1700 supported
Supermicro Intel Mother Board X13SEW-FX13SEW-F- Supermicro Intel Mother Board X13SEW-F
Supermicro Intel Mother Board X13SEW-TFX13SEW-TF- Supermicro Intel Mother Board X13SEW-TF
Supermicro Intel Mother Board X14SBI-FX14SBI-FKey Features
- Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
- 6 PCIe 5.0 x8 via MCIO connectors
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- 3 PCIe 5.0 x16,
- 3 PCIe 5.0 x8,
- M.2 Interface: 2 PCIe 5.0 x2
- M.2 Form Factor: 22110
- M.2 Key: M-Key
- Dual LAN with 1GbE with Intel®I210
- Onboard TPM2.0
- 4 USB 3.2 Gen1 (2 rear, 2 via header), 4 SATA3 (via SlimSAS x4)
Supermicro Intel Mother Board X14SBI-TFX14SBI-TFKey Features
- Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
- 6 PCIe 5.0 x8 via MCIO connectors
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- 3 PCIe 5.0 x16,
- 3 PCIe 5.0 x8,
- M.2 Interface: 2 PCIe 5.0 x2
- M.2 Form Factor: 22110
- M.2 Key: M-Key
- Dual LAN with 10GBase-T with Intel®X550
- Onboard TPM2.0
Supermicro Intel Mother Board X14SBM-TFX14SBM-TFKey Features
- Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
- 4 PCIe 5.0 X8 via MCIO connectors
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- 1 PCIe 5.0 x8,
- 2 PCIe 5.0 x16,
- M.2 Interface: 2 PCIe 5.0 x2
- M.2 Form Factor: 2280, 22110
- M.2 Key: M-Key
- Dual LAN with 10GBase-T with Intel® X710-AT2
- Onboard TPM2.0
Supermicro Intel Mother Board X14SBM-TP4FX14SBM-TP4FKey Features
- Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
- 4 PCIe 5.0 X8 via MCIO connectors
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- 1 PCIe 5.0 x8,
- 2 PCIe 5.0 x16,
- M.2 Interface: 2 PCIe 5.0 x2
- M.2 Form Factor: 2280, 22110
- M.2 Key: M-Key
- Quad LAN with 2x 10GBase-T and 2x 10G SFP+ with Intel® X710-TM4
- 4 USB 3.2 Gen1 (2 rear, 2 via header), 2 SATA3 ports
Supermicro Intel Mother Board X14SBW-FX14SBW-FKey Features
- Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
- 4 PCIe 5.0 X8 via MCIO connectors
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- 1 PCIe 5.0 x8 (WIO-R),
- 2 PCIe 5.0 x16 (WIO-L),
- M.2 Interface: 2 PCIe 5.0 x2
- M.2 Form Factor: 2280, 22110
- M.2 Key: M-Key
- Dual LAN with 1GbE with Intel®I210
- Onboard TPM2.0
Supermicro Intel Mother Board X14SBW-TFX14SBW-TFKey Features
- Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots
- 4 PCIe 5.0 X8 via MCIO connectors
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- 1 PCIe 5.0 x8 (WIO-R),
- 2 PCIe 5.0 x16 (WIO-L),
- M.2 Interface: 2 PCIe 5.0 x2
- M.2 Form Factor: 2280, 22110
- M.2 Key: M-Key
- Dual LAN with 10GBase-T with Intel®X550
- Onboard TPM2.0
